Test and burn-in socket for integrated circuits (ics)

ABSTRACT

Disclosed herein is a test and burn-in socket for integrated circuits. The socket includes a socket body ( 37 ). A lead guide ( 36 ) is provided under the socket body. A slide ( 35 ) is mounted to the socket body to move horizontally. A plurality of slide springs ( 39 ) is elastically supported between the slide and the socket body, thus allowing the slide to smoothly restore an original position thereof. A contact guide ( 31 ) is provided above the slide to guide positions of upper contact terminals of contacts. An IC guide ( 30 ) is provided above the contact guide to guide a position of an IC. A cover ( 21 ) is provided to move vertically from the socket body ( 37 ). A latch ( 29 ) presses the IC. The socket also includes the contacts ( 33 ).

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 11/720,612filed Jun. 1, 2007 which is a 371 of international applicationPCT/KR2005/004378 filed Dec. 19, 2005 which claims priority to KoreanPatent Application No 10-2004-0108545 filed Dec. 20, 2004.

TECHNICAL FIELD

The present invention relates to a test and burn-in socket forintegrated circuits and, more particularly, to a socket for an LGA (LandGrid Array).

BACKGROUND ART

Generally, a socket for ICs (Integrated Circuits) is loaded in a testboard or a burn-in board. The socket is connected to measuring devicesfor measuring the properties of a burn-in chamber or peripheral devicesand an IC, thus being used in a system for testing a series of ICs. Inthis case, the burn-in chamber is used to input and output power and anelectric signal, which are required to drive the IC, through an I/Oterminal (input and output terminal) formed on the board (test board,burn-in board).

Among the ICs that have been widely used, a BGA (Ball Grid Array) typeof IC is shaped as shown in FIGS. 1 and 2. Terminals of the IC, that is,balls, are arranged throughout the bottom of the IC, thus dramaticallyreducing the size and thickness of the IC.

Generally, the pitch between the balls of the BGA-type IC is 0.5 mm,0.75 mm, 0.8 mm, 1.0 mm, 1.27 mm, 1.6 mm, etc. Each ball has a diameterfrom 0.3 mm to 0.9 mm. The height from the lower surface of the BGA-typeIC to each ball is set to 0.2 mm to 0.6 mm. As the pitch between theballs is reduced, the diameter and height of the ball is reduced.

Meanwhile, as shown in FIGS. 3 and 4, an LGA-type IC is an IC whichremoves balls from the BGA-type IC A socket for loading the LGA-type ICis provided with a plurality of contacts having a predetermined elasticforce in a vertical direction. The lower terminal of each contact isconnected to a PCB (Printed Circuit Board).

In this case, the upper terminal of each contact is formed to contactthe land of the LGA-type IC which is loaded in the socket. Thus, adevice for pressing down the LGA-type IC so as to provide stableelectrical contact must be provided on the socket.

When a physical force acting on the LGA-type IC by the pressing deviceis divided by the number of contacts, a physical force applied to onecontact is calculated. The physical force applied to the contacts isabout 15 gf per contact. Assuming that the LGA-type IC has 1000 lands,strong physical force of about 15 Kgf is required. Thus, the socket inwhich the LGA-type IC is loaded must be provided with a latch so as toefficiently apply strong physical force to the IC. The socket must bealso provided with reliable contacts which may stably transmitadditional power or signals.

A conventional representative socket for loading an LGA-type IC isprovided with contacts 16 which are bent in an arc shape, as shown inFIGS. 5 and 6. Further, the socket is provided with a lever 13 whichpresses the LGA-type IC with a strong physical force. The contacts 16are elastically deformed downwards by the lever 13.

As described above, the conventional socket for the LGA-type IC isproblematic in that the contacts are arranged and assembled usingadditional parts for assembling the contacts having the arc-shaped bentparts, so that a greater number of components is required, assembly isdifficult, and the lever for applying strong physical force and thesocket for operating the lever have complicated constructions. Theconventional socket has another problem in that the cost thereof isincreased and the quality thereof is deteriorated due to the complicatedconstruction of the socket.

DISCLOSURE Technical Problem

Accordingly, the present invention has been made keeping in mind theabove problems occurring in the prior art, and an object of the presentinvention is to provide a test and burn-in socket for integratedcircuits (ICs), in which contacts provided on the socket have astraight-line shape so as to increase the productivity and uniformity ofcomponents and afford easy treatment of the components, a plurality ofcontacts held in the socket is deformed to an arc shape by pressing acover of the socket, and thereafter an IC is loaded in the socket, theIC is pressed downwards using a plurality of latches, and a physicalforce acting on the IC is removed when a cover returns to its originalposition, so that upper terminals of the contacts have a constantphysical force through elastic restoring force of the contacts which aredeformed in the arc shape and contact lands of the IC.

Another object of the present invention is to provide a test and burn-insocket for ICs, in which a lever is constructed to be locked, when an ICis pressed and force is increased, so that latches are moved in an opendirection, that is, moved upwards so that upper terminals of contactsare restored to their original shapes, namely, straight-line shapes,thus efficiently pressing the IC.

Technical Solution

In order to accomplish the objects, the present invention provides atest and burn-in socket for integrated circuits (ICs), including asocket body 37 having a plurality of contact support holes 42 to receiveand support a plurality of contacts 33 therein, and a plurality ofpositioning pins 49 to secure the socket body to a predeterminedposition on a printed circuit board (PCB); a lead guide 36 providedunder the socket body 37, and having a plurality of lead guide holes 40;a slide 35 mounted to the socket body 37 to move horizontally within apredetermined range, and having a plurality of contact parts 34contacting slide cams 22 to allow smooth sliding motion of the slide,and a plurality of contact through holes 14 through which upper contactterminals 61 of the contacts 33 pass; a plurality of slide springs 39elastically supported between the slide 35 and the socket body 37, thusallowing the slide 35 to smoothly restore an original position thereof;a contact guide 31 provided above the slide 35, having a plurality ofterminal through holes 43 used to arrange the upper contact terminals 61of the contacts at predetermined positions, and guiding positions of theupper contact terminals 61 of the contacts; an IC guide 30 providedabove the contact guide 31 to guide a position of an IC; a cover 21moving vertically from the socket body 37 to a maximum moving distanceS, and including a plurality of cover springs 26 elastically supportedbetween the cover and the socket body 37, a plurality of slide cams 22,and a plurality of slot plates 24 each having a latch cam slot 25; alatch 29 pressing the IC, and including a fixed hole 28 to fix the latchto the socket body 37 using a latch moving shaft, and a movable hole 27to move along an inclined surface of the latch cam slot 25; and theplurality of contacts 33 each having an upper contact terminal 61, anelastic part 62, and a lower contact terminal 63 that are provided in astraight-line shape, and an U-shaped body fitting part 64.

Preferably, when the cover 21 moves downwards, the slide 35 is movedrightwards by inclined surfaces 23 of the slide cams, and the elasticparts 62 of the contacts 33 fitted into the contact through holes 44 areelastically deformed in an arc shape.

Further, the latch cam slot 25 includes a gentle slope 47 curved in anarc shape and having a gentle curvature, and a steep slope 48 having asteeper curvature, in comparison with the gentle slope 47.

The present invention provides a test and burn-in socket for integratedcircuits (ICs), including a socket body 67 having a plurality of boltinsert holes 99 used to fasten the socket body to a PCB using bolts, aplurality of holes 80 through which a plurality of lower contactterminals 75 of contacts pass, and a plurality of positioning pins 49 tosecure the socket body to a predetermined position of a printed circuitboard (PCB); a slide 65 mounted to the socket body 67 to movehorizontally within a predetermined range, and including a plurality oflower stop holes 81 through which the lower contact terminals 75 of thecontacts pass, and a plurality of cam contact parts 64; a plurality ofslide springs 39 elastically supported between the slide 65 and thesocket body 67, thus allowing the slide 65 to smoothly restore anoriginal position thereof; a contact guide 90 having a plurality ofupper stop holes 91 through which upper contact terminals of thecontacts pass, and guiding positions of the upper contact terminals 74of the contacts; a cover 21 elastically biased towards the socket body67 by a cover spring 26, moving vertically from the socket body 67 to amaximum moving distance, and including a plurality of slide cams 22, anda plurality of slot plates 24 each having a latch cam slot 25; a latch29 pressing an IC, and including a fixed hole 28 to fix the latch to thesocket body 67 using a latch moving shaft, and a movable hole 27 to movealong an inclined surface of the latch cam slot 25; and a plurality ofcontacts 73 each including an upper contact terminal 74, a lower contactterminal 75, an upper stop protrusion 76, and a lower stop protrusion 77that are provided in a straight-line shape.

Preferably, when the cover 21 moves downwards, the slide 65 is movedrightwards by inclined surfaces 23 of the slide cams 22, and thecontacts fitted into the lower stop holes 81 of the slide 65 areelastically deformed in an arc shape.

Further, the latch cam slot 25 includes a gentle slope 47 curved in anarc shape and having a gentle curvature, and a steep slope 48 having asteeper curvature than the gentle slope 47.

Further, the present invention provides a test and burn-in socket forintegrated circuits (ICs), including a socket body 141 having aplurality of holes 142 through which a plurality of lower terminals 161of pogo contacts pass, the holes formed to prevent contact bodies 160from being dislodged from predetermined positions, a plurality ofpositioning pins 49 to secure the socket body to a predeterminedposition on a printed circuit board (PCB), and a plurality of boltinsert holes 99 used to fasten the socket body to the PCB using bolts; acontact guide 151 having a plurality of holes through which upperterminals 162 of the pogo contacts pass, the holes formed to prevent thecontact bodies 160 from being dislodged from predetermined positions; anIC guide 130 provided above the contact guide 151 to guide an IC, andincluding a plurality of moving holes 131 formed in a seating surface133 on which the IC is seated, and supporting the upper terminals 162 ofthe pogo contacts such that the upper terminals are vertically movable;a plurality of springs 132 elastically supported between the IC guide130 and the contact guide 151; a cover 21 elastically biased to thesocket body 141 via a plurality of cover springs 26, moving verticallyfrom the socket body 141 to a maximum moving distance, and including aplurality of slot plates 24 each having a lath cam slot 25; a latch 29pressing the IC, and including a fixed hole 28 used to fasten the latchto the socket body 141 using a latch moving shaft, and a movable hole 27to move along an inclined surface of the latch cam slot of the cover;and a plurality of pogo contacts each having a contact body 160, a lowerterminal 161, and an upper terminal 162 that are provided in astraight-line shape, and a spring provided in the contact.

Preferably, the latch cam slot includes a gentle slope 47 curved in anarc shape and having a gentle curvature, and a steep slope 48 having asteeper curvature than the gentle slope 47.

The present invention provides a test and burn-in socket for integratedcircuits (ICs), including a socket body 241 having a plurality of holes242 through which a plurality of lower terminals 261 of pogo contactspass, the holes formed to prevent contact bodies 260 from beingdislodged from predetermined positions, a plurality of positioning pins49 to secure the socket body to a predetermined position on a printedcircuit board (PCB), and a plurality of bolt insert holes 99 used tofasten the socket body to the PCB using bolts; a contact guide 251having a plurality of holes 252 through which upper terminals 262 of thepogo contacts pass, the holes formed to prevent the contact bodies 260from being dislodged from predetermined positions; an IC guide 130provided above the contact guide 251 to guide an IC, and including aplurality of moving holes 131 formed in a seating surface 133 on whichthe IC is seated, and supporting the upper terminals 262 of the pogocontacts such that the upper terminals are vertically movable; aplurality of springs 132 elastically supported between the IC guide 130and the contact guide 251; a cover 221 elastically biased toward thesocket body 241 by a plurality of cover springs 26, moving verticallyfrom the socket body 241 to a maximum moving distance S, and including aplurality of supports 222 each having a shaft hole 224, with a latchmoving shaft 223 passing through the shaft hole; a latch 270 pressingthe IC using an IC press part 272, and including a rotary hole 273 usedto fasten the latch to the socket body 241 via a latch rotary shaft 274,a spring support hole 276, and a latch cam 271 moving while contactingthe latch moving shaft 223, when the latch moving shaft mounted on thecover 221 moves vertically; a latch torsion spring 275 biased in adirection opening the latch; and a plurality of pogo contacts eachhaving a contact body 260, a lower terminal 261, and an upper terminal262 that are provided in a straight-line shape, and a spring provided inthe contact.

Preferably, the latch cam 271 includes a gentle slope 277 having agentle curvature, and a steep slope 278 having a steeper curvature thanthe gentle slope.

DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view showing a BGA-type IC;

FIG. 2 is a side view showing the BGA-type IC;

FIG. 3 is a plan view showing an LGA-type IC;

FIG. 4 is a side view showing the LGA-type IC;

FIG. 5 is a plan view showing a conventional IC socket;

FIG. 6 is a vertical sectional view showing the conventional IC socket;

FIG. 7 is a plan view of a test and burn-in socket for ICs, according tothe first embodiment of the present invention;

FIG. 8 is a vertical sectional view taken along line X1-X1 of FIG. 7;

FIG. 9 is a vertical sectional view taken along line X2-X2 of FIG. 7;

FIG. 10 is a front view of a contact, according to the first embodimentof this invention;

FIG. 11 is a side view of the contact, according to the first embodimentof this invention;

FIG. 12 is a view illustrating the method of assembling the contact,according to the first embodiment of this invention;

FIGS. 13 to 17 are vertical sectional views showing the operation of thetest and burn-in socket for ICs, according to the first embodiment ofthis invention;

FIG. 18 is a plan view of a test and burn-in socket for ICs, accordingto the second embodiment of the present invention;

FIG. 19 is a vertical sectional view taken along line X3-X3 of FIG. 18;

FIG. 20 is a vertical sectional view taken along line X4-X4 of FIG. 18;

FIG. 21 is a front view of a contact, according to the second embodimentof this invention;

FIG. 22 is a side view of the contact, according to the secondembodiment of this invention;

FIG. 23 is a view illustrating the method of assembling the contact,according to the second embodiment of this invention;

FIGS. 24 to 28 are vertical sectional views showing the operation of thetest and burn-in socket for ICs, according to the second embodiment ofthis invention;

FIG. 29 is a plan view of a test and burn-in socket for ICs, accordingto the third embodiment of the present invention;

FIG. 30 is a vertical sectional view taken along line X5-X5 of FIG. 29;

FIGS. 31 to 33 are vertical sectional views showing the operation of thetest and burn-in socket for ICs, according to the third embodiment ofthis invention;

FIG. 34 is a plan view of a test and burn-in socket for ICs, accordingto a modification of the present invention;

FIG. 35 is a vertical sectional view taken along line X7-X7 of FIG. 34;and

FIGS. 36 to 38 are vertical sectional views showing the operation of thetest and burn-in socket for ICs, according to the modification of thisinvention.

DESCRIPTION OF REFERENCE CHARACTERS OF IMPORTANT PARTS

 1: BGA(Ball Grid Array)-type IC  2: soldering ball  3: LGA(Land GridArray)-type IC  4: land 12, 21: cover 13: lever 24: slot plate 25: latchcam slot 26: cover spring 29: latch 31, 90, 151: contact guide 37, 67,141: body 61, 74: upper contact terminal of contact 63, 75: lowercontact terminal of contact 47: gentle slope 48: steep slope

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in detail withreference to the accompanying drawings.

Reference now should be made to the drawings, in which the samereference numerals are used throughout the different drawings todesignate the same components. For clarity of description of the presentinvention, the detailed description of known functions and constructionswill be omitted.

A test and burn-in socket for ICs, according to the first embodiment ofthe present invention, will be described with reference to FIGS. 7 to17. FIG. 7 is a plan view of a test and burn-in socket for ICs,according to the first embodiment of the present invention, FIG. 8 is avertical sectional view taken along line X1-X1 of FIG. 7, FIG. 9 is avertical sectional view taken along line X2-X2 of FIG. 7, FIG. 10 is afront view of a contact, according to the first embodiment of thisinvention, FIG. 11 is a side view of the contact, according to the firstembodiment of this invention, and FIG. 12 is a view illustrating themethod of assembling the contact, according to the first embodiment ofthis invention.

As shown in FIGS. 7 to 9, a body 37 of the test and burn-in socket forICs, according to the first embodiment of the present invention,includes a plurality of contact support holes 42 and a plurality ofpositioning pins 49. The contact support holes 42 receive and support aplurality of contacts 33 therein. The positioning pins 49 secure thesocket body to a predetermined position on a PCB. In this case, thesocket body 37 serves as a base for assembling a slide 35, a latch 29, acontact guide 31, and a cover 21.

A lead guide 36 is provided under the socket body 37. Lead guide holes40 are positioned at ends of lower contact terminals 63 of the contacts,via the lead guide 36.

The lead guide 36 functions to maintain the lower contact terminals 63in a straight line without bending the lower contact terminals 63.Further, when the socket is assembled with the PCB, the lead guide 36functions to precisely insert the lower contact terminals 63 intothrough holes of the PCB. When the socket is inserted into the PCB, thelead guide is introduced into the lower surface of the body 37.

The slide 35 is mounted to the socket body 37. In FIG. 8, which is avertical sectional view taken along line X1-X1 of FIG. 7, the slide 35is movable in a horizontal direction within a predetermined range.Further, the slide 35 is provided with a plurality of contact parts 34.The contact parts 34 contact slide cams 22 to allow the smooth slidingmotion of the slide 35 when a plurality of contact through holes 44through which upper contact terminals 61 of the contacts pass and theslide cams 22 of the cover 21 move up and down.

Further, in order to allow the slide 35 to smoothly return to itsoriginal position when the slide cams 22 move upwards, a plurality ofslide springs 39 is elastically supported between the slide 35 and thesocket body 37.

The contact guide 31 is provided above the slide 35, and guides thepositions of the upper contact terminals 61 of the contacts, in additionto supporting an IC guide 30. A plurality of terminal through holes 43is formed in the contact guide 31 to arrange the upper contact terminals61 of the contacts at predetermined positions. In this case, the ICguide 30 functions to position each land of the IC and each uppercontact terminal 61 on the same line in a vertical direction, and guidethe position of the IC. The slide 35 functions to push an elastic part62 of each contact 33 rightwards, thus elastically deforming the contactin the arc shape.

In this embodiment, it is apparent that the IC guide 30 may be changedaccording to the size of the IC loaded in the socket.

The cover 21 is constructed to move up and down relative to the body 37by reference character S (maximum moving distance), with a plurality ofcover springs 26 elastically supported between the cover 21 and thesocket body 37. Further, the cover 21 is provided with a plurality ofslide cams 22 to move the slide 35 to the right of FIG. 8 which is avertical sectional view taken along line X1-X1 of FIG. 7, when the cover21 moves downwards. Further, a plurality of slot plates 24 each having alatch cam slot 25 is provided on the cover 21, so that the latch 29 isoperated through each slot plate 24.

In this case, the latch cam slot 25 is curved in an arc shape, andincludes a gentle slope 47 which has a gentle curvature and a steepslope 48 having a steeper curvature, in comparison with the gentle slope47.

A plurality of latches 29 is provided on the socket. A fixed hole 8,formed in each latch 29, is fixed to the socket body 37 using a shaft(hereinafter, referred to as a “latch moving shaft”), which is parallelto the line X2-X2 of FIG. 7. Preferably, the latch moving shaft servesas a rotating center of each latch 29. According to this embodiment, thelatch 29 comprises two or four latches provided on the socket. However,the present invention is not limited to this embodiment.

Like the fixed hole 28, a movable hole 27 is secured to the socket bodyusing a moving shaft which is parallel to line X2-X2. The moving shaftmoves along an inclined surface formed inside each latch cam slot 25. Atthis time, when the cover 21 is pressed, the cover springs 26 arepressed, and simultaneously the latches 29 are opened. Meanwhile, whenthe cover 21 is restored to its original state by the elastic force ofthe cover springs 26, the latches 29 are dosed. Particularly, the steepslope 48 of each latch cam slot 25 is at 10 degrees on a vertical axis,thus generating a latch rotating force which is 5 times as great as aforce moving the cover 21 upwards. Thereby, the latch structure forstrongly pressing the IC using an upward moving force of the cover 21 isachieved.

Meanwhile, as shown in FIGS. 10 and 11, each contact 33 includes theupper contact terminal 61, the elastic part 62, and the lower contactterminal 63, which are not curved but are provided in a straight-lineshape, and a shaped body fitting part 64.

Further, as shown in FIG. 12, each contact 33 is inserted into thecontact support hole 42 and a lead through hole 41, both of which areformed in the socket body 37. Subsequently, the body fitting part 64 isforce-fitted into an associated contact support hole 42 of the socketbody 37, thus securing the contacts 33 such that upper and lowerpositions thereof are constant. According to this embodiment, eachcontact 33 comprises a gold-plated copper alloy so as to improveelectrical characteristics, such as electric conductivity. However, thepresent invention is not limited to the gold-plated copper alloy.

Hereinafter, the operation of the test and burn-in socket for ICs, whichis constructed as described above, according to the first embodiment ofthe present invention, will be described in detail with reference toFIGS. 13 to 17. FIGS. 13 to 17 represent the first to fifth steps of theoperation. FIGS. 13 to 17 are vertical sectional views showing theoperation of the test and burn-in socket for ICs, according to the firstembodiment of this invention.

First, as shown in FIG. 13, in the first step showing the initial stateof the socket, the cover 21 is located at the uppermost position whilebeing elastically supported by the cover springs 26. The slide 35 islocated at an initial position where the slide 35 is elastically pushedby the slide springs 39.

At this time, as shown in FIGS. 7 to 9, the lead through hole 41 of eachcontact 33, each contact support hole 44 of the slide 35, and eachterminal through hole 43 of the contact guide 31 are aligned in a row ina vertical direction. The straight line-shaped contact 33 is verticallyerected without any deformation, such as bending. Further, each latch 29is located at the front end of the lower surface of the correspondinglatch cam slot 25 of the cover 21 by the latch moving shaft. At thistime, the latch 29 is closed.

Next, in the second step of FIG. 14, the cover 21 is pressed downwards(state S1) by about ½ of the maximum moving distance S, and each slidecam 22 moves the slide 35 rightwards. The left wall of each contactsupport hole 44 pushes an associated contact 33 rightwards, thuselastically deforming the contact 33 in the arc shape. Further, theupper contact terminals 61 move downwards to a height which is similarto the upper surface of the contact guide 31, in comparison with theinitial position of the first step.

In the first step, the latch moving shaft is constructed so that therotating distance of the latch moving shaft from the steep slope 48 ofeach latch cam slot 25 to the outer portion of the socket is very short.Thus, in the second step, each latch 29 is located at a position similarto the initial state of the first step.

Thereafter, in the third step of FIG. 15, the cover 21 is completelypressed downwards. That is, the cover 21 is moved downwards by themaximum moving distance 5, in comparison with the initial state of thefirst step. While being changed from the second step to the third step,each slide cam 22 no longer pushes the slide 35, but simply movesdownwards. At this time, the steep slope 47 of each latch cam slot 25serves to push the latch moving shaft out of the socket, thus openingthe latch 29.

When the socket is ready to load the IC through the third step, the ICdrops from an upper position into the IC guide 30. At this time, the ICguide 30 positions the IC within a range where the lands of the ICcorrespond to the terminals (upper contact terminals, lower contactterminals) of the contacts.

Next, in the fourth step of FIG. 16, showing the state where the IC isloaded in the socket, the cover 21 returns to a position correspondingto ½ of the maximum moving distance S. At this time, while each latchmoving shaft completely passes through the gentle slope 47 of the latchcam slot 25, an end 46 of each latch presses the IC downwards. In thiscase, the curved surface of each slide cam 22 continuously pushes theslide 35, so that each contact 33 maintains an elastically deformedstate.

Thereafter, in the fifth step of FIG. 17, while the steep slope 48 ofeach latch cam slot 25 moves upwards, it pushes the latch moving shafttoward the lower portion of the socket, that is, in a direction ofpressing the IC by the latch 29, with a strong force. Through suchoperations, the IC moves downwards by a very short distance, and theinclined surface 23 of each slide cam moves upwards. Thereby, a forcepushing the slide 35 is eliminated.

Afterwards, the slide 35 moves leftwards by the slide springs 39, sothat each contact 33 is intended to be restored to the straight-lineshape of the first step. At this time, each latch 29 presses the IC froma position above the contacts 33, and the upper contact terminals 61contact the lands of the IC while having a predetermined force.Thereafter, a contact state is maintained while a predetermined elasticenergy is retained. Consequently, the lands of the IC are in electricalcontact with the upper contact terminals 61 of the contacts, so thatpower and input signals supplied from the exterior through the lowercontact terminals 63 are transmitted to the IC, thus performing varioustest operations.

According to the first embodiment of the present invention, the test andburn-in socket for ICs is a soldering-type socket.

Hereinbefore, the test and burn-in socket for ICs, according to thefirst embodiment of this invention, has been described. Hereinafter, atest and burn-in socket for ICs, according to the second embodiment ofthis invention, will be described with reference to FIGS. 18 to 23. FIG.18 is a plan view of a test and burn-in socket for ICs, according to thesecond embodiment of the present invention, FIG. 19 is a verticalsectional view taken along line X3-X3 of FIG. 18, FIG. 20 is a verticalsectional view taken along line X4-X4 of FIG. 18, FIG. 21 is a frontview of a contact, according to the second embodiment of this invention,FIG. 22 is a side view of the contact, according to the secondembodiment of this invention, and FIG. 23 is a view illustrating themethod of assembling the contact, according to the second embodiment ofthis invention.

As shown in FIGS. 18 to 20, the socket is provided with a plurality ofbolt insert holes 99, so that it may be fastened to a PCB using bolts. Asocket body 67 includes a plurality of holes 80 through which lowercontact holes 75 of contacts pass, and a plurality of positioning pins49 to secure the socket body to a predetermined position of the PCB. Inthis case, the socket body 67 serves as a base for assembling a slide65, a latch 29, a contact guide 90, and a cover 21.

The slide 65 is mounted to the socket body 67. In FIG. 19, which is avertical sectional view taken along line X3-X3 of FIG. 18, the slide 65is movable in a horizontal direction within a predetermined range.Further, the slide 65 is provided with a plurality of lower stop holes81 through which the lower contact terminals 75 of the contacts pass anda plurality of contact parts 64. The contact parts 64 allow the smoothsliding motion of the slide when slide cams 22 of the cover 21 move upand down.

Further, in order to allow the slide 65 to smoothly return to itsoriginal position when the slide cams 22 move upwards, a plurality ofslide springs 39 is elastically supported between the slide 65 and thesocket body 67.

The contact guide 90 is provided above the slide 65, and guides thepositions of upper contact terminals 74 of the contacts, in addition tosupporting an IC guide 30. A plurality of upper stop holes 91 is formedin the contact guide 90 to arrange the upper contact terminals 74 of thecontacts at predetermined positions. In this case, the IC guide 30functions to position each land of the IC and each upper contactterminal 74 on the same line in a vertical direction, and guide theposition of the IC.

In this embodiment, it is apparent that the IC guide 30 may be changedaccording to the size of the IC loaded in the socket.

The cover 21 is constructed to move up and down relative to the body 67by reference character S (maximum moving distance), with a plurality ofcover springs 26 elastically supported between the cover 21 and thesocket body 67. Further, the cover 21 is provided with a plurality ofslide cams 22 to move the slide 65 to the right of FIG. 19 which is avertical sectional view taken along line X3-X3 of FIG. 18, when thecover 21 moves downwards. At this time, the slide 65 pushes the middleportion of each contact 73 rightwards, so that the contact 73 iselastically deformed in an arc shape. Further, a plurality of slotplates 24 each having a latch cam slot 25 is provided on the cover 21,so that the latch 29 is operated through each slot plate 24.

In this case, the latch cam slot 25 is curved in an arc shape, andincludes a gentle slope 47 which has a gentle curvature and a steepslope 48 having a steeper curvature, in comparison with the gentle slope47.

A plurality of latches 29 is provided on the socket. Each latch 29 issecured to the socket body 67 by inserting a shaft (hereinafter,referred to as a “latch moving shaft”), which is parallel to the lineX4-X4 of FIG. 18, into a fixed hole 28. Preferably, the latch movingshaft serves as a rotating center of each latch 29. According to thisembodiment, the latch 29 comprises two or four latches provided on thesocket. However, the present invention is not limited to thisembodiment.

Like the fixed hole 28, a movable hole 27 is secured to the socket bodyusing a moving shaft which is parallel to line X4-X4 of FIG. 18. Themoving shaft moves along an inclined surface formed inside each latchcam slot 25 of the cover 21. At this time, when the cover 21 is presseddownwards, the cover springs 26 are pressed, and simultaneously thelatches 29 are opened. Meanwhile, when the cover 21 is restored to itsoriginal state by the elastic force of the cover springs 26, the latches29 are closed. Particularly, the steep slope 48 of each latch cam slot25 is at 10 degrees on a vertical axis, thus generating a latch rotatingforce which is 5 times as great as a force moving the cover 21 upwards.Thereby, the latch structure for strongly pressing the IC using anupward moving force of the cover 21 is achieved.

Meanwhile, as shown in FIGS. 21 and 22, each contact 73 is not curvedbut is provided in a straight-line shape, and includes the upper contactterminal 74, the lower contact terminal 75, an upper stop protrusion 76,and a lower stop protrusion 77. In this case, the lower contactterminals 75 of the contacts are constructed to contact the terminals ofthe PCB with a predetermined contact force, in the same manner in whichthe upper contact terminals 74 are in contact with the lands of the ICloaded in the socket. Awarding to this embodiment, each contact 73comprises a gold-plated copper alloy so as to improve electricalcharacteristics, such as electric conductivity. However, the presentinvention is not limited to the gold-plated copper alloy.

As shown in FIG. 23, the contacts 73 are inserted into correspondingslide through holes 84, in the state where the socket body 67 isassembled with the slide 65. In this case, each slide through hole 84has a flared shape so that each lower contact terminal 75 is easilyinserted into the corresponding slide through hole 84.

Meanwhile, locking steps 83 are provided on the slide 65 so as toprevent the lower stop protrusions 77 of the contacts inserted throughenlarged holes 82 from being undesirably dislodged from the slide 65.The locking steps 83 limit the length of the lower contact terminals 75protruding from the bottom of the socket.

After the contacts 73 are inserted into the slide through holes 84 andthe holes 80, the contacts 73 are arranged in a row. In such a state,the contact guide 90 is assembled with the upper portions of thecontacts 73.

Contact through holes 94, enlarged holes 92, and locking steps 93 areformed in the contact guide 90 in the same vertical axis as the slidethrough holes 84 formed in the slide 65 and the holes 80 of the body.Thus, after the upper contact terminals 74 pass through the contactthrough holes 94 of the contact guide 90, the upper stop protrusions 76are inserted into the enlarged holes 92 of the contact guide 90, and aresimultaneously stopped by the locking steps 93. Thereby, the removal ofthe upper stop protrusions 76 is prevented.

Hereinafter, the operation of the test and burn-in socket for ICs, whichis constructed as described above, according to the second embodiment ofthe present invention, will be described in detail with reference toFIGS. 24 to 28. FIGS. 13 to 17 represent the first to fifth steps of theoperation. FIGS. 24 to 28 are vertical sectional views showing theoperation of the test and burn-in socket for ICs, according to thesecond embodiment of this invention.

First, in the first step of FIG. 24 showing the initial state of thesocket, the cover 21 is located at the uppermost position by the coversprings 26, and the slide 65 is located at the initial position which ispushed by the slide springs 39. At this time, the holes 80 of the socketbody 67, the lower stop holes 81, and the upper stop holes 91 arevertically arranged in a row. The straight-line-shaped contacts 73 arevertically erected without any deformation such as bending. Further,each latch 29 is located at the front end of the lower surface of thelatch cam slot 25 of the cover 21 via the latch moving shaft. At thistime, the latch 29 is closed.

Next, in the second step of FIG. 25, the cover 21 is pressed downwards(state S1) by about ½ of the maximum moving distance S, and each slidecam 22 moves the slide 65 rightwards. The left wall of each upper stophole 81 pushes an associated contact 73 rightwards, thus elasticallydeforming the contact 73 in the arc shape. Further, the upper contactterminals 74 move downwards to a height which is similar to the uppersurface of the contact guide 90, in comparison with the initial positionof the first step.

In the first step, the latch moving shaft is constructed so that therotating distance of the latch moving shaft from the steep slope 48 ofeach latch cam slot 25 to the outer portion of the socket is very short.Thus, in the second step, each latch 29 is located at a position similarto the initial state of the first step.

Thereafter, in the third step of FIG. 26, the cover 21 is completelypressed downwards. That is, the cover 21 is moved downwards by themaximum moving distance 5, in comparison with the initial state of thefirst step. While being changed from the second step to the third step,each slide cam 22 no longer pushes the slide 35, but simply movesdownwards. At this time, the steep slope 47 of each latch cam slot 25serves to push the latch moving shaft out of the socket, thus openingthe latch 29.

When the socket is ready to load the IC through the third step, the ICdrops from an upper position into the IC guide 30. At this time, the ICguide 30 positions the IC within a range where the lands of the ICcorrespond to the terminals (upper contact terminals, lower contactterminals) of the contacts.

Next, in the fourth step of FIG. 27, showing the state where the IC isloaded in the socket, the cover 21 returns to a position correspondingto ½ of the maximum moving distance S. At this time, while each latchmoving shaft completely passes through the gentle slope 47 of the latchcam slot 25, an end 46 of each latch presses the IC downwards. In thiscase, the curved surface of each slide cam 22 continuously pushes theslide 65, so that each contact 73 maintains an elastically deformedstate.

Thereafter, in the fifth step of FIG. 28, while the steep slope 48 ofeach latch cam slot 25 moves upwards, it pushes the latch moving shafttoward the lower portion of the socket, that is, in a direction ofpressing the IC by the latch 29, with a strung force. Through suchoperations, the IC moves downwards by a very short distance, and theinclined surface 23 of each slide cam moves upwards. Thereby, a forcepushing the slide 65 is eliminated.

Afterwards, the slide 65 moves leftwards by the slide springs 39, sothat each contact 73 is intended to be restored to the straight-lineshape of the first step. At this time, each latch 29 presses the IC froma position above the contacts 73, and the upper contact terminals 74contact the lands of the IC while having a predetermined force.Thereafter, a contact state is maintained while a predetermined elasticenergy is retained.

Consequently, the lands of the IC are in electrical contact with theupper contact terminals 74 of the contacts, so that power and inputsignals supplied from the exterior through the lower contact terminals75 are transmitted to the IC, thus performing various test operations.

According to the second embodiment of the present invention, the testand burn-in socket for ICs is a surface-mount-type socket.

Hereinbefore, the test and burn-in socket for ICs, according to thefirst embodiment of this invention, has been described. Hereinafter, atest and burn-in socket for ICs, according to the second embodiment ofthis invention, will be described with reference to FIGS. 29 and 30.FIG. 29 is a plan view of a test and burn-in socket for ICs, accordingto the third embodiment of the present invention, and FIG. 30 is avertical sectional view taken along line X5-X5 of FIG. 29.

As shown in FIGS. 29 and 30, the socket according to the thirdembodiment of the present invention is a socket using pogo contacts.Each pogo contact includes a contact body 160 accommodating a springhaving a predetermined elastic force therein, a lower terminal 161, andan upper terminal 162. The lower terminal 161 and the upper terminal 162are operated by the spring.

As shown in FIGS. 29 and 30, a socket body 141 is provided with aplurality of bolt insert holes 99 to be fastened to terminals formed ona PCB using bolts. A plurality of holes 142 and a plurality ofpositioning pins 49 are formed in the lower portion of the socket body141. Lower terminals 161 of the pogo contacts pass through the holes142. Further, the holes 142 are formed to prevent the contact bodies 160from being dislodged from predetermined positions. The positioning pins49 secure the socket body to a predetermined position on the PCB.Preferably, the socket body 141 serves as a base for assembling a latch29, a contact guide 151, and a cover 21.

Further, the contact guide 151 is provided on the upper portion of thesocket body 141 so that the upper terminals 162 of the pogo contactsmovably pass through the contact guide 151. A plurality of holes 152 isformed in the contact guide 151 at regular intervals so as to preventthe contact bodies 160 from being dislodged from predeterminedpositions. In this case, the pogo contacts are assembled between thecontact bodies 160 and the contact guide 151, as shown in FIG. 30.

An IC guide 130 is provided to guide the IC such that a land of the ICloaded in the socket is located along the same vertical axis as eachpogo contact terminal (upper terminal, lower terminal). In thisembodiment, it is apparent that the IC guide 130 may be changedaccording to the size of the IC loaded in the socket.

A seating surface 133 is provided on the upper portion of the contactguide 151. A plurality of moving holes 131 is formed in the seatingsurface 133, and supports the upper terminals 162 such that the upperterminals 162 are vertically movable. Further, a plurality of springs132 having a predetermined elastic force is elastically supportedbetween the IC guide 130 and the contact guide 151.

In the initial state where the IC is not loaded, the seating surface 133is positioned to be higher than ends of the upper terminals 162 of thepogo contacts. When the IC is loaded in the socket, an end 46 of eachlatch presses the IC, and the IC guide 130 moves downwards along withthe loaded IC. At this time, the ends of the upper terminals 162protrude through the moving holes 131, so that the seating surface 133contacts the lands of the IC, and moves downwards by a pressed distance.

Further, the cover 21 is provided to move vertically relative to thesocket body 141 by the maximum moving distance S. A plurality of coversprings 26 is elastically supported between the cover 21 and the socketbody 141. Further, a plurality of slot plates 24 each having a latch camslot 25 is provided on the cover 21, so that the latches 29 are operatedthrough the slot plates.

In this case, the latch cam slot 25 includes a gentle slope 47 and asteep slope 28. The gentle slope 47 is curved in an arc shape and has agentle curvature. The steep slope 28 has a steeper curvature than thegentle slope 47.

A plurality of latches 29 is provided on the socket. A fixed hole 28,formed in each latch, is fixed to the socket body 141 using a shaft(hereinafter, referred to as a “latch moving shaft”), which is parallelto the line X6-X6 of FIG. 29. Preferably, the latch moving shaft servesas a rotating center of each latch 29.

Further, a movable hole 27 is secured to the socket body using a movingshaft which is parallel to line X6-X6. The moving shaft moves along aninclined surface formed inside each latch cam slot 25 of the cover 21.At this time, when the cover 21 is pressed downwards, the latches 29 areopened. Meanwhile, when the cover 21 is restored to its original stateby the elastic force of the cover springs 26, the latches 29 are closed.Particularly, the steep slope 48 of each latch cam slot 25 is at 10degrees on a vertical axis, thus generating a latch rotating force whichis 5 times as great as a force moving the cover 21 upwards. Thereby, thelatch structure for strongly pressing the IC using an upward movingforce of the cover 21 is achieved.

Hereinafter, the operation of the test and burn-in socket for ICs, whichis constructed as described above, according to the third embodiment ofthe present invention, will be described in detail with reference toFIGS. 31 to 33. FIGS. 31 to 33 represent the first to third steps of theoperation. FIGS. 31 to 33 are vertical sectional views showing theoperation of the test and burn-in socket for ICs, according to the thirdembodiment of this invention.

First, as shown in FIG. 31, in the first step showing the initial stateof the socket, the cover 21 is located at the uppermost position by thecover springs 26. Further, each latch 29 is located at the front end ofthe lower surface of the corresponding latch cam slot 25 of the cover bythe latch moving shaft. At this time, each latch 29 is closed. Further,the IC guide 130 is elastically supported by the plurality of springs132, thus being located at an initial position where the IC guide 130 ispushed upwards.

Next, in the second step of FIG. 32, the cover 21 is moved completelydownwards by the maximum moving distance S, in comparison with theinitial state of the first step. Each latch 29 is opened by the latchcam slot 25.

When the socket is ready to load the IC through the second step, the ICdrops from an upper position into the IC guide 130. At this time, the ICguide 130 positions the IC within a range where the lands of the ICcorrespond to the terminals (upper terminals, lower terminals) of thecontacts.

Next, in the third step of FIG. 33, showing the state where the IC isloaded in the socket, an end 46 of each latch presses the IC downwardswhile each latch moving shaft completely passes through the gentle slope47 of the latch cam slot 25. At this time, while the steep slope 48 ofeach latch cam slot 25 moves upwards, it pushes the latch moving shafttoward the lower portion of the socket, that is, in a direction ofpressing the IC by the latch 29, with a strong force. The cover 21returns to its original position, just like in the first step. Further,the IC and the IC guide 130 move downwards together, and the upperterminals 162 of the pogo contacts contact the lands of the IC.Afterwards, the upper terminals 162 move downwards until the IC guide130 reaches the upper surface of the contact guide 151. The upperterminals 162 contact the lands of the IC with a predetermined force.

As a result, through the operation of the third step, the lands of theIC are in electrical contact with the terminals (upper terminals, lowerterminals) of the contacts. Through the terminals of the contacts, powerand signals are transmitted to the IC, so that it is possible to executevarious test operations.

It is obvious that various types of contacts, such as a spring contactor a pogo contact, may be applied to the test and burn-in socket for ICsaccording to the third embodiment of this invention.

Hereinbefore, the test and burn-in socket for ICs, according to thethird embodiment of this invention, has been described. Hereinafter, atest and burn-in socket for ICs, according to a modification of thisinvention, will be described with reference to FIGS. 34 and 35. FIG. 34is a plan view of a test and burn-in socket for ICs, according to amodification of the present invention, and FIG. 35 is a verticalsectional view taken along line X7-X7 of FIG. 34.

As shown in FIGS. 34 and 35, the modification of the present inventionuses a pogo contact which is very short in length. The pogo contactincludes a contact body 260 accommodating a spring having apredetermined elastic force, a lower terminal 261, and an upper terminal262. The lower terminal 261 and the upper terminal 262 are operated by aspring.

As shown in FIGS. 34 and 35, a socket body 241 is provided with aplurality of bolt insert holes 99 to be fastened to terminals formed ona PCB using bolts. A plurality of holes 242 and a plurality ofpositioning pins 49 are formed in the lower portion of the socket body241. Lower terminals 261 of the pogo contacts pass through the holes242. Further, the holes 242 are formed to prevent the contact bodies 260from being dislodged from predetermined positions. The positioning pins49 secure the socket body to a predetermined position on the PCB.Preferably, the socket body 241 serves as a base for assembling a latch270, a contact guide 251, and a cover 221.

Further, the contact guide 251 is provided on the upper portion of thesocket body 241 so that the upper terminals 262 of the pogo contactsmovably pass through the contact guide 251. A plurality of holes 252 isformed in the contact guide 251 at regular intervals so as to preventthe contact bodies 260 from being dislodged from predeterminedpositions. In this case, the pogo contacts are assembled between thesocket body 241 and the contact guide 151, as shown in FIG. 35.

An IC guide 130 is provided to guide the IC such that a land of the ICloaded in the socket is located along the same vertical axis as eachpogo contact terminal (upper terminal). In this embodiment, it isapparent that the IC guide 130 may be changed according to the size ofthe IC loaded in the socket.

A seating surface 133 is provided on the upper portion of the contactguide 251, so that the IC is seated on the seating surface. A pluralityof moving holes 131 is formed in the seating surface 133, and supportsthe upper terminals 262 such that the upper terminals 262 are verticallymovable.

Further, a plurality of springs 132 having a predetermined elastic forceis elastically supported between the IC guide 130 and the contact guide251. In the initial state where the IC is not loaded, the seatingsurface 133 is positioned to be higher than ends of the upper terminals262 of the pogo contacts. When the IC is loaded in the socket, a presspart 272 of each latch shown in FIG. 35 presses the IC, and the IC guide130 moves downwards along with the loaded IC. At this time, the ends ofthe upper terminals 262 protrude through the moving holes 131, so thatthe seating surface 133 contacts the lands of the IC, and movesdownwards by a pressed distance.

Further, the cover 221 is provided to move vertically relative to thesocket body 241 by the maximum moving distance S. A plurality of coversprings 26 is elastically supported between the cover 221 and the socketbody 241.

A shaft hole 224 is formed in the cover 221, so that each latch movingshaft 223 assembled with a plurality of supports 222 passes through theshaft hole 224. Each latch is operated via the latch moving shaft 223.In this case, the shaft assembled with the cover comprises two or fourshafts, so that it is possible to form two or four latches.

Each latch 270 is rotatably fastened via a latch rotary shaft 274 havinga rotary hole 273. The latch 270 includes the press part 272 whichpresses the IC, and a latch cam 271 which movably contacts each latchmoving shaft 223 fastened to the cover 221. Each latch 270 is normallybiased in an open direction by a latch torsion spring 275 elasticallysupported between the socket body 241 and the latch. Thus, one end ofthe latch torsion spring 275 is fastened to a spring support hole 243which is formed in the socket body, while the other end of the latchtorsion spring 275 is fastened to a spring support hole 276 which isformed in each latch.

The latch cam 271 includes a gentle slope 277 and a steep slope 278having a steeper curvature than the gentle slope 277. In the case wherethe IC is loaded in, the socket and then the cover 221 returns to itsoriginal position, the IC press part 273 of each latch presses the ICdownwards while the latch moving shaft 223 of the cover passing throughthe steep slope 278 of the latch, thus pressing the IC guide 130 and theupper terminals 262 of the contacts. Thereby, the IC is electricallyconnected to the upper terminals of the pogo contact. Particularly,since the steep slope 278 is at 10 degrees to the latch moving shaft223, a latch rotating force which is 5 times as large as a force ofmoving the cover upwards is generated. When the distance from therotating shaft 274 to the latch moving shaft 223 when the cover 221 isat the original position is twice as large as a horizontal distance fromthe latch rotary shaft 274 to the IC press part 272, the IC is pressedwith a force which is about ten times as large as the upward movingforce of the cover.

Hereinafter, the operation of the test and burn-in socket for ICs, whichis constructed as described above, according to the modification of thepresent invention, will be described in detail with reference to FIGS.36 to 38. FIGS. 36 to 38 represent the first to third steps of theoperation. FIGS. 36 to 38 are vertical sectional views showing theoperation of the test and burn-in socket for ICs, according to themodification of this invention.

First, as shown in FIG. 36, in the first step showing the initial stateof the socket, the cover 221 is located at the uppermost position by thecover springs 26. Thus, the latch moving shaft 223 is positioned at thefront end of the steep slope 278 of each latch 270. At this time, eachlatch 29 is closed. Further, the IC guide 130 is elastically supportedby the plurality of springs 132, thus being located at an initialposition where the IC guide 130 is pushed upwards.

Next, in the second step of FIG. 37, the cover 221 is moved completelydownwards by the maximum moving distance 5, in comparison with theinitial state of the first step. Each latch 270 is opened by the latchtorsion spring 275.

When the socket is ready to load the IC through the second step, the ICdrops from an upper position into the IC guide 130. At this time, the ICguide 130 positions the IC within a range where the lands of the ICcorrespond to the terminals (upper terminals) of the contacts.

Next, in the third step of FIG. 38, showing the state where the IC isloaded in the socket, an end 273 of each latch presses the IC downwardswith a strong force while each latch moving shaft 223 passes through thesteep slope 278 of the latch. The cover 21 returns to its originalposition, just like in the first step. Further, the IC and the IC guide130 move downwards together, and the upper terminals 262 of the pogocontacts contact the lands of the IC. Afterwards, the upper terminals262 move downwards until the IC guide 130 reaches the upper surface ofthe contact guide 251. The upper terminals 262 contact the lands of theIC with a predetermined force.

As a result, through the operation of the third step, the lands of theIC are in electrical contact with the terminals (upper terminals, lowerterminals) of the contacts. Through the terminals of the contacts, powerand signals are transmitted to the IC, so that it is possible to executevarious test operations.

It is obvious that various types of contacts, such as a spring contactor a pogo contact, may be applied to the test and burn-in socket for ICsaccording to the modification of this invention.

Although the preferred embodiments of the present invention have beendisclosed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and spirit of the inventionas disclosed in the accompanying claims.

INDUSTRIAL APPLICABILITY

According to the present invention, a straight-line-shaped contact isprovided on a soldering-type socket for LGA, a surface-mount-type socketfor LGA, or a socket for LGA which is a surface-mount-type socket anduses a pogo contact, a spring contact, etc., so that a slide and a latchare operated by a slide cam and a latch cam slot formed in a cover, thecontact is elastically deformed by the moving operation of the slide,the latch presses an IC downwards relative to the socket after the IC isloaded in the socket, and thereafter, an elastic force applied to thecontact is eliminated, so that the contact contacts the IC by arestoring force of the contact, thus simplifying the construction of thesocket in comparison with a conventional socket and reducing costs ofthe product, in addition to enhancing reliability.

Further, the present invention provides a socket for mainly testing anLGA-type IC. However, the present invention may be variously applied toa BGA-type IC or other types of ICs. Moreover, this invention may beapplied to a socket for loading new types of ICs which may be inventedin the future.

1. A test and burn-in socket for integrated circuits (ICs), comprising:a socket body, comprising: a plurality of holes through which aplurality of lower terminals of pogo contacts pass, the holes formed toprevent contact bodies from being dislodged from predeterminedpositions; a plurality of positioning pins to secure the socket body toa predetermined position on a printed circuit board (PCB); and aplurality of bolt insert holes used to fasten the socket body to the PCBusing bolts; a contact guide having a plurality of holes through whichupper terminals of the pogo contacts pass, the holes formed to preventthe contact bodies from being dislodged from predetermined positions; anIC guide provided above the contact guide to guide an IC, andcomprising: a plurality of moving holes formed in a seating surface onwhich the IC is seated, and supporting the upper terminals of the pogocontacts such that the upper terminals are vertically movable; aplurality of springs elastically supported between the IC guide and thecontact guide; a cover elastically biased toward the socket body by aplurality of cover springs, moving vertically from the socket body to amaximum moving distance, and comprising: a plurality of supports eachhaving a shaft hole, with a latch moving shaft passing through the shafthole; a latch pressing the IC using an IC press part, and comprising: arotary hole used to fasten the latch to the socket body via a latchrotary shaft; a spring support hole; and a latch cam moving whilecontacting the latch moving shaft, when the latch moving shaft mountedon the cover moves vertically; a latch torsion spring biased in adirection opening the latch; and a plurality of pogo contacts eachcomprising: a contact body, a lower terminal, and an upper terminal thatare provided in a straight-line shape; and a spring provided in thecontact.
 2. The test and burn-in socket as set forth in claim 1, whereinthe latch cam comprises: a gentle slope having a gentle curvature; and asteep slope having a steeper curvature than the gentle slope.